Home
Products
Services
Request a Quote
Contact Us
About Us
Html Javascript Menu by Vista-Buttons.com v5.5


Featured Product

Gap Pad 3000S30 is a thermally conductive reinforced, soft S-Class Gap filling material. Click here to learn more.


Bond-Ply® and
Liqui-Bond® Adhesives

Bond-Ply Adhesive Tapes are thermally conductive and electrically isolating.

Liqui-Bond liquid adhesives are high-performance, thermally conductive liquid adhesive materials. They are ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink.

View Selection Chart (pdf)
Bond-Ply 100
Bond-Ply 400
Bond-Ply 660B
Bond-Ply 660P
Liqui-Bond SA 1000 (One-Part)
Liqui-Bond SA 1800 (One-Part)
Liqui-Bond SA 2000 (One-Part)

 

 

 

 

Thermally
Conductive
Interface Materials
for Cooling
Electronic
Assemblies

  • Gap Pad® – Thermally Conductive Gap Filling Materials

  • Sil-Pad® – Thermally Conductive Insulators

  • Bond-Ply® and Liqui-Bond® – Thermally Conductive Adhesives

  • Hi-Flow® – Phase Change Interface Materials