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Featured Product

Gap Pad 3000S30 is a thermally conductive reinforced, soft S-Class Gap filling material. Click here to learn more.

Gap PadŽ Thermally Conductive Materials

The Bergquist Garp Pad family was designed to meet the electronic industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.

The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surfaces are present.

View Selection Chart (pdf)  
Gap Pad VO Gap Pad 2500S20
Gap Pad VO Soft Gap Pad 2500
Gap Pad VO Ultra Soft Gap Pad A3000
Gap Pad 1000SF Gap Pad 3000S30
Gap Pad HC1000 Gap Pad 5000S35
Gap Pad 1500 Gap Filler 1000 (Two-Part)
Gap Pad 1500R Gap Filler 1100SF (Two-Part)
Gap Pad 1500S30 Gap Filler 1500 (Two-Part)
Gap Pad A2000 Gap Filler 2000 (Two-Part)
Gap Pad 2000S40 Gap Filler 3500S35 (Two-Part)
Gap Pad 2200SF  



Interface Materials
for Cooling

  • Gap Pad® – Thermally Conductive Gap Filling Materials

  • Sil-Pad® – Thermally Conductive Insulators

  • Bond-Ply® and Liqui-Bond® – Thermally Conductive Adhesives

  • Hi-Flow® – Phase Change Interface Materials