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Featured Product

Gap Pad 3000S30 is a thermally conductive reinforced, soft S-Class Gap filling material.Click here to learn more.


Hi-Flow® Phase Change Interface Materials

Hi-Flow phase change interface materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink.

View Selection Chart (pdf)
Hi-Flow 105
Hi-Flow 225F-AC
Hi-Flow 225FT
Hi-Flow 225UT
Hi-Flow 225U
Hi-Flow 625
Hi-Flow 300P
Hi-Flow 300G
Hi-Flow 565U
Hi-Flow 565UT

 








Thermally
Conductive
Interface Materials
for Cooling
Electronic
Assemblies

  • Gap Pad® – Thermally Conductive Gap Filling Materials

  • Sil-Pad® – Thermally Conductive Insulators

  • Bond-Ply® and Liqui-Bond® – Thermally Conductive Adhesives

  • Hi-Flow® – Phase Change Interface Materials