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Featured Product

Gap Pad 3000S30 is a thermally conductive reinforced, soft S-Class Gap filling material. Click here to learn more.


Products

Rico Products Inc. offers a variety of solution-driven thermal management products for electronic devices.

Thermally Conductive Interface Materials
EMI/RFI shielding
Fishpaper Formex GK® Statex®
Vulcanized Fibre Formex Nomex®
Nylon Copaco® Kapton®
Teflon® GPO-3 Forbon®
Polycarbonate Acetal Peerless®
Lexan® Bakelite® Kydex®
Polypropylene Phenolic Acrylic
Nylatron® PVC Plexiglass®
Ragpaper Polyethylene Glastic®
Rag/Mylar Vinyl Delrin®
Mylar® Nylon MDS Aramid Paper
PTFE Acetate Polystyrene
UHMW Neoprene ABS
And others…


Thermally
Conductive
Interface Materials
for Cooling
Electronic
Assemblies

  • Gap Pad® – Thermally Conductive Gap Filling Materials

  • Sil-Pad® – Thermally Conductive Insulators

  • Bond-Ply® and Liqui-Bond® – Thermally Conductive Adhesives

  • Hi-Flow® – Phase Change Interface Materials