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Featured Product

Gap Pad 3000S30 is a thermally conductive reinforced, soft S-Class Gap filling material. Click here to learn more.


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Thermally
Conductive
Interface Materials
for Cooling
Electronic
Assemblies

  • Gap Pad® – Thermally Conductive Gap Filling Materials

  • Sil-Pad® – Thermally Conductive Insulators

  • Bond-Ply® and Liqui-Bond® – Thermally Conductive Adhesives

  • Hi-Flow® – Phase Change Interface Materials