Controlled-Viscosity Molding (CVM)
Thermally conductive polymers rely on high filler loadings to enhance thermal properties. Conventional low-pressure overmolding equipment simply cannot handle highly filled thermally conductive compounds. Rico Products operates X2F equipment engineered for the pressures and flow parameters these materials demand.
Equipment Built for Thermally Conductive Materials
X2F’s controlled-viscosity platform enables overmolding with compounds
that no standard machine can run reliably.
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Low-Pressure & Low-Velocity Flow
Real-time closed loop pressure management accommodates the variable viscosity profiles of filled thermoplastics without breaking fibers or degrading polymer chains.
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Low Stress Electronics Encapsulation
Safe for overmolding delicate electronics, replacing labor-intensive potting and conformal coating with robust, thermally conductive and environmentally sealed protection.
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Advanced Material Processing
Supports a wide range of engineering, filled, and functional thermoplastics, giving teams more flexibility to choose materials for performance, durability, thermal, and environmental resistance.
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Repeatable Shot-to-Shot Performance
X2F’s unique “Extrude to Fill” process combines specialized hardware, sensors, software, and a process feedback loop to precisely control back-screw pressure screw velocity, and torque during each shot.
Where Overmolded TC Polymers Solve Real Design Problems
From power conversion to electrified motors, overmolding with thermally conductive (TC) polymers helps dissipate heat, protects electronics, and unlocks more reliable high-performance designs.