Selecting your thermal interface material
Rico Products, Inc. is a leading thermal solutions provider for electronic devices. We offer the full product line of Henkel BERGQUIST® thermal materials. Start your search by visiting the appropriate product category. Each section outlines features, benefits and typical applications. Use our Bergquist Roadmaps to help guide you towards locating products within the correct thermal conductivity range. For specific product data, technical characteristics and more specific thermal properties, click or download the product data sheet. If you are unable to find the material you are searching for, contact us and we can send it to you by email.
BERGQUIST GAP FILLER TGF 4500CVO
Henkel liquid thermal gap filler accelerates dispensing, reduces contamination risk and improves reliability.
Bergquist Gap Filler TGF 4500CVO is a high thermal conductivity, controlled volatility material that maximizes heat dissipation and alleviates outgassing concerns. The liquid, gap filling thermal interface material dramatically improves on conventional TIM dispensing speeds, while delivering high thermal conductivity of 4.5 W/m-K in a controlled volatility product. Read more >
BERGQUIST LIQUI FORM TLF4500CGEL-SF
4.5 W/m-K, one-component, cure-in-place liquid Thermal Interface Material based on silicone-free chemistry.
This latest Henkel TIM material meets the needs of ADAS with increased power systems. Its silicone-free technology passes hazing and fogging tests, and is optimized for optical systems. The thermal material offers consistency for high throughput manufacturing as a cure-in-place gel. It offers excellent vertical gap stability for long-term reliability and performance. Read more >
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