Technical Data Sheets I MSDS

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Bergquist GAP PAD Family


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Featured Material

BERGQUIST LIQUI FORM TLF4500CGEL-SF

4.5 W/m-K, one-component, cure-in-place liquid Thermal Interface Material based on silicone-free chemistry.
This latest Henkel TIM material meets the needs of ADAS with increased power systems. Its silicone-free technology passes hazing and fogging tests, and is optimized for optical systems. The thermal material offers consistency for high throughput manufacturing as a cure-in-place gel. It offers excellent vertical gap stability for long-term reliability and performance. Read more >