Chemistries the Industry Trusts.
Conversions OEMs need.

Rico Products partners with global material and equipment suppliers that support the world’s most demanding high-reliability electronics. We bring advanced materials and state-of-the-art processing equipment together to deliver thermally conductive materials in the precise geometry, format, and package size your production line consumes.

Multiple

Tier-One Partners

100%

Custom Conversion Capability

55-gal to cc

Down-Pack Range

Industry-standard TIMs across silicone and silicone-free chemistries.

Key Product Families

  • Gap Pad TGP & Gap Filler TGF series
  • Sil Pad TSP series
  • Bond Ply tape & film adhesives
  • HiFlow phase change pads
  • Liqui Form TLF dispensable gap fillers
  • UV / dual-cure product lines
  • Pre-cured dispensable TIMs

Typical Applications

EV battery packs, ADAS modules, telecom,
IGBT power stacks, LED lighting.

Request Sample

High thermal conductivity TIM materials including silicone and non-silicone compounds.

Key Product Families

  • Liquid gap fillers
  • Putty gap fillers
  • PAO-based thermal greases
  • Pre-cured TIM pads
  • Thermally conductive potting compounds

Typical Applications

MOSFETs, IGBTs, CPUs, GPUs, industrial
drives, power motors, automotive sensors.

Request Sample

Thermally conductive structural adhesives, encapsulants, potting compounds, and foams.

Key Product Families

  • Conductive adhesives
  • Polyurethane & MMA-based technologies
  • Epoxy encapsulant systems
  • Flame-retardant potting (UL94)
  • Thermally conductive fillers
  • Dielectric coatings

Typical Applications

EV batteries, transformers, busbar isolation,
motor potting, LED lighting.

Request Sample

Ceramic and graphite-filled polymers with high through-plane conductivity.

Key Product Families

  • Keratherm ceramic gap pads
  • Silicone & silicone-free gap filler liquids
  • Graphite films
  • Phase-change materials (PCMs)
  • Thermally conductive tapes
  • Thermal greases
  • Injection molding granulate

Typical Applications

Automotive ECUs, e-mobility, RF amplifiers,
power electronics, energy storage, CPUs.

Request Sample

Swiss-engineered adhesives, gap fillers, and encapsulants designed for protection and heat dissipation.

Key Product Families

  • Structural adhesives
  • Gap fillers & potting compounds
  • Encapsulants & pastes
  • Epoxy, polyurethane & acrylic systems

Typical Applications

High-voltage sensor potting, motor magnet
bonding, optical assembly, electronics
housing seal.

Request Sample

Broad network of leading equipment and material suppliers, backed by expert technical support.

Key Services

  • Thermal solutions support
  • In-house design expertise
  • Application engineering
  • Material evaluation and validation
  • Material samples

Typical Applications

High-reliability electronic systems operating
in demanding environments.

Request Sample

Ultra-soft silicone gels, elastomers, gap fillers, and gel pads for stress-sensitive components.

Key Product Families

  • TC-AC gel pads & TC-30 gap fillers
  • KE-1051 / KE-1056 silicone gels
  • Two-part RTV silicones
  • Reinforced silicone pads
  • High-conductivity grease

Typical Applications

IC modules, CPUs/GPUs, IGBTs, RF power
amplifiers, semiconductor packaging, EV
inverters, MEMS protection.

Request Sample

Advanced thermal polymer molding equipment.

Key Product Families

  • Thermally conductive overmolding
  • Custom molded heatsink geometries
  • Net-shape TIM components
  • Advanced polymer composites

Typical Applications

Custom heat spreaders, integrated cooling
assemblies, lightweight heatsinks.

Request Sample

Want to join our supplier network?