Features and Benefits
The BERGQUIST BOND PLY family of Henkel materials are thermally conductive and electrically isolating. BOND PLY is available in a PSA or laminating format. BOND PLY provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. BOND PLY provides high structural bond strength in severe environments. It can be a replacement to heat cure adhesives, screw and clip mounting.
Henkel’s current product name is first, followed by Bergquist’s legacy name second. Both products are the same formulation.