New Gap Filler Formulation Available


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PRESS RELEASE
November 11, 2020

High thermal conductivity, controlled volatility material maximizes heat dissipation and alleviates outgassing concerns

Henkel liquid thermal gap filler accelerates dispensing, reduces contamination risk and improves reliability

Düsseldorf – Recognizing the requirement in many market sectors for thermal interface materials (TIMs) that can enhance processability while complying with increasingly challenging performance and cost metrics, Henkel has leveraged a new formulation approach in the development of Bergquist Gap Filler TGF 4500CVO. The liquid, gap filling thermal interface material dramatically improves on conventional TIM dispensing speeds, while simultaneously delivering high thermal conductivity of 4.5 W/m-K in a controlled volatility product. Balancing viscosity, high thermal conductivity and controlled volatile outgassing is a challenging formulation achievement, but Bergquist Gap Filler TGF 4500CVO successfully delivers these attributes in a material with low-stress, silicone-like mechanical properties. 

As Justin Kolbe, Henkel Director of Market Strategy for Power and Industrial Automation, notes, highly-filled, high thermal conductivity liquid TIMs have complex rheologies and are often challenging to dispense quickly. “Among other characteristics, Bergquist Gap Filler TGF 4500CVO resolves the dispensing rate dilemma with excellent processability, no separation and good print fidelity,” he says, explaining that normally fast deposition or high thermal conductivity are binary formulation choices. “New Henkel resin and filler innovation has allowed an ‘all of the above’ scenario in a material that secures low cost of ownership alongside reduced siloxane contamination risk.”

Historically, to overcome the processing difficulties of highly-filled liquid TIM products, material developers have integrated low molecular weight binders to reduce viscosity in an effort to accelerate dispense rates. However, this practice can result in the production of mobilized volatiles that interfere with mechanical contacts, optical components and sensitive environments. Therefore, Henkel’s novel silicone-based resin chemistry and filler approach are significant, particularly for mass production, volatile-susceptible applications such as industrial automation and power conversion, automotive electronics, computers and peripherals and devices integrating optical components.

Bergquist Gap Filler TGF 4500CVO is a two-part, 4.50 W/m-K liquid thermal interface material with a unique polymer resin structure that, when combined with novel filler processing, dispenses quickly at a rate of up to 4.9 cc/second with no caking or separation. The slump-resistant liquid thoroughly fills gaps and complex topographies, reducing thermal resistance and imparting little to no assembly stress on substrates and component interconnects. Containing less than 300 ppm volatile silicones, Bergquist Gap Filler TGF 4500CVO can be integrated into virtually any environment without fear of contamination or functional interference.

“Unless you are a chemist, it may be difficult to appreciate how ingenious the Bergquist Gap Filler TGF 4500CVO formulation is,” Kolbe concludes. “But the results speak for themselves: easily processed, high throughput, high thermal conductivity, low risk, improved operational reliability and cost-competitive. For certain applications, this product delivers on all fronts.”

To learn more visit our Gap Filler section and download the TDS: Bergquist Gap Filler TGF 4500CVO
Photo material is available at www.henkel.com/press

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Bergquist Gap Filler TGF 4500CVO is a liquid, gap filling thermal interface material that accelerates dispensing, reduces contamination risk and improves reliability.
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Download PR: PDF
Media Contact: Scott Rico
Phone: +1 440-543-9209
Email: s.rico@rico-inc.com


Rico Offers New Thermal Management Materials for LED Lighting Applications.


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PRESS RELEASE
December 1, 2020

Sheldahl and Rico Products join efforts to deliver new forward-thinking LED thermal solutions to customers.

Northfield, MN – Effective December 1st, 2020, Sheldahl Flexible Technologies Inc., a Flex Company, is proud to announce that Rico Products, Inc. will be the official Sales Representative for Sheldahl’s Thermal Management Materials and Circuit offerings into the LED space. Sheldahl Flexible Technologies, for the last 65 years, has taken our customer’s ideas and turned them into solutions. 

Sheldahl Flexible Technologies’ Thermal Management Materials and Circuit offerings reduce system cost and increase reliability to solve the concerns of high power LEDs. Sheldahl’s Novaclad™ HDI adhesive has fewer laminates and Q-Prime® copper-aluminum composite is a unique, flexible interconnect solution developed for high current applications. Sheldahl is excited to partner with Ohio-based Rico Products, a privately held, woman-owned business with outstanding thermal management, component and physical design experience. Their sales team has experience in identifying new designs and early engagement for thermal management solutions.

Thermal management has a strong impact on the performance, lifecycle and the cost of LED luminaires. Combining the strengths of our two companies’ brings unmatched design possibilities and technical experience. We are very excited about the ability to deliver new forward-thinking thermal solutions to our customers.”
– Scott Rico, President of Rico Products, Inc.

For more information on Rico Products, Inc. please visit https://rico-inc.com
For more information on Sheldahl Flexible Technologies, please visit https://www.sheldahl.com

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Sheldahl’s flexible printed circuits offer a broad array of physical and electrical interconnect solutions that cannot be achieved with rigid printed circuit board solutions.
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Novaclad™ HDI offers single and double-layer flexible interconnects that thrive under extreme conditions in electronic applications.

Download PR: PDF
Media Contact: Scott Rico
Phone: +1 440-543-9209
Email: s.rico@rico-inc.com


Rico Products Is Now Stocking Henkel Bergquist Thermal Interface Materials.

A complete range of thermal materials for filling air gaps and enhancing thermal conductivity.

As a long term partner, Rico Products is now stocking and die-cutting the entire line of Henkel BERGQUIST® GAP PADs, SIL PADs, phase change materials and liquid dispensed options.